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Chips JU welcomes the outcome of the “Strategic Dialogue on the Future of the Automotive Industry
06-03-2025

Chips JU welcomes the outcome of the “Strategic Dialogue on the Future of the Automotive Industry"

The Chips Joint Undertaking welcomes the Industrial Action Plan for the European automotive sector announced by the European Commission on 5th March, most notably for its focus on Innovation and Digitalisation, which is one of the five key pillars of this Automotive Action Plan.

NEWS
ECS Brokerage event - Strengthening collaboration for semiconductor innovation
24-02-2025

ECS Brokerage event - Strengthening collaboration for semiconductor innovation

The Electronic Components and Systems (ECS) Brokerage Event 2025, held on 18 and 19 February at Hotel Le Plaza in Brussels, brought together key stakeholders from the European semiconductor ecosystem.

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European Commission hosts a Ceremonial Event for the launch of Chips JU Pilot Lines
17-01-2025

European Commission hosts a Ceremonial Event for the launch of Chips JU Pilot Lines

The European Commission hosted a signature ceremony for the Chips JU pilot lines, marking the formalisation of the groundbreaking €3.7 billion investment from the European Union and Participating States to strengthen capacity building and innovation in Europe.

NEWS
Chips JU Adopts Amendment to Multiannual Work Programme 2023-2027
10-01-2025

Chips JU Adopts Amendment to Multiannual Work Programme 2023-2027

The Chips Joint Undertaking (Chips JU) has adopted an amendment to its Multiannual Work Programme (MAWP) for 2023-2027, introducing significant updates to its strategic initiatives for 2025.

NEWS
Recap of EFECS 2024: Strengthening EU Competitiveness to connect with leaders and innovators driving
18-12-2024

Recap of EFECS 2024: Strengthening EU Competitiveness to connect with leaders and innovators driving

The European Forum for Electronic Components and Systems (EFECS) 2024, held on December 5-6, brought together more than 700 participants,

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APECS marks a milestone for the European semiconductor industry
18-12-2024

APECS marks a milestone for the European semiconductor industry

The Pilot Line on Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS) is ready to fly.