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Contribute to the ECS SRIA 2027 and help define Europe's R&I agenda
The AENEAS, EPoSS, and INSIDE Industry Associations have started the preparation of the 10th edition of the Electronic Components and Systems Strategic Research and Innovation Agenda (ECS-SRIA 202), and the ECS community is invited to contribute.
First APECS Open Access Call started
The APECS Open Access Call is open to applications from stakeholders across the entire semiconductor ecosystem, including large companies, RTOs, universities, and in particular SMEs as well as start-ups.
FAMES Pilot Line Launches 2026 Open-Access Call
The FAMES Pilot Line has launched its 2026 Open-Access Call, inviting industry players, research institutions and academic organisations across Europe to apply for early access to advanced chip design and manufacturing technologies.
The Chips JU advances quantum and semiconductor innovation with an investment over €659M
The Public Authorities Board of the Chips Joint Undertaking has retained 17 proposals for funding, supporting innovation in quantum technologies , electronic components and systems (ECS), and electronic design automation (EDA).
ECS SRIA 2026 Released
The industry associations AENEAS, EPoSS, and INSIDE proudly announce the publication of the 2026 edition of the Electronic Components and Systems Strategic Research and Innovation Agenda (ECS-SRIA).
Registration is open for EFECS 2025
We’re excited to announce that registration is officially open for the EFECS – the European Forum for Electronic Components and Systems, taking place in Malta, on December 3–4
