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Upcoming Events
FIRST by FMD – The European conference on microelectronic trends, roadmaps and strategic alignment
Join the leaders shaping Europe’s semiconductor future at FIRST by FMD, taking place 30 September – 1 October 2026 in Berlin.
INSIDE Connect 2026
Two days of strategic alignment, collaboration, and forward-thinking discussions shaping Europe’s digital future.
EFECS 2026
Join us from 𝟮 - 𝟯 𝗗𝗲𝗰𝗲𝗺𝗯𝗲𝗿, 𝟮𝟬𝟮𝟲, in 𝗛𝗲𝗹𝘀𝗶𝗻𝗸𝗶, 𝗙𝗶𝗻𝗹𝗮𝗻𝗱, for the next edition of the European Forum for Electronic Components and Systems, for a full week of networking opportunities and cultural activities!
Previous Events
FAMES Inauguration
Serving the European microelectronics industry, the FAMES pilot line aims to advance and strengthen the European Union's semiconductor capabilities and to secure its technological sovereignty.
HiPEAC 2026
The HiPEAC conference is the premier European forum for experts in computer architecture, programming models, compilers and operating systems for general-purpose, embedded and cyber-physical systems.
Online workshop on Quantum Enabling Technologies & Quantum Design
The Chips Joint Undertaking is organising a workshop to present the two quantum technology topics planned for the 2026 calls.
ECS Brokerage Event
Dive into the heart of Denver, enveloping yourself in the vibrant atmosphere within the Sheraton Denver Downtown Hotel and beyond its walls. Situated in proximity to the renowned 16th Street Mall and the historically rich Larimer Square, this establishment invites you to explore the cultural tapestry of the city.
EFECS 2025
EFECS 2025 is the premier European Forum for Electronic Components and Systems, dedicated to advancing the sector’s growth and innovation. Taking place in Malta on December 3-4, 2025, this event brings together industry leaders, policymakers, researchers, and innovators to strengthen Europe’s strategic leadership in semiconductor technology.
EU CHIPS ACCESS & INNOVATION WORKSHOP
Meet and discover the FAMES Pilot Line activities, as well as those of the Austrian Chips Competence Center (ATC3) and the European Chips Design Platform (EuroCDP).
