Events

Upcoming Events

EVENTS
30-09-2026
Registration

FIRST by FMD – The European conference on microelectronic trends, roadmaps and strategic alignment

Join the leaders shaping Europe’s semiconductor future at FIRST by FMD, taking place 30 September – 1 October 2026 in Berlin.

EVENTS
30-09-2026
Registration

INSIDE Connect 2026

Two days of strategic alignment, collaboration, and forward-thinking discussions shaping Europe’s digital future.

EVENTS
02-12-2026
Registration

EFECS 2026

Join us from 𝟮 - 𝟯 𝗗𝗲𝗰𝗲𝗺𝗯𝗲𝗿, 𝟮𝟬𝟮𝟲, in 𝗛𝗲𝗹𝘀𝗶𝗻𝗸𝗶, 𝗙𝗶𝗻𝗹𝗮𝗻𝗱, for the next edition of the European Forum for Electronic Components and Systems, for a full week of networking opportunities and cultural activities!

Previous Events

EVENTS
13-03-2025

Horizon Implementation Days 2025: Finding opportunities and submitting a proposal in Horizon Europe

Finding opportunities and submitting a proposal in Horizon Europe

EVENTS
11-03-2025

Embedded World 2025

Connecting the embedded community

EVENTS
21-02-2025

Call deciphering Chips Joint Undertaking : Workprogramme 2025 : ECS Part

The FAMN - French Automotive & Mobility Network invites you to the Webinar - Call deciphering Chips Joint Undertaking : Workprogramme 2025 : ECS Part

EVENTS
18-02-2025

ECS Brokerage Event 2025

This event gathers the ECS community around project ideas, allowing it to network, build consortia and start creating project proposals.

EVENTS
05-02-2025

Chips JU Introduction Webinar (Denmark)

The EU Chips Joint Undertaking (Chips JU) is set to transform Europe’s semiconductor landscape with an anticipated budget of nearly €11 billion by 2030. This initiative will provide a wide range of opportunities for Danish companies and universities. Near-term opportunities are the up-coming Chips JU 2025 calls, including

EVENTS
20-01-2025

HiPEAC conference

The HiPEAC conference is the premier European forum for experts in computer architecture, programming models, compilers and operating systems for general-purpose, embedded and cyber-physical systems. Areas of focus and integration include safety-critical dependencies, cybersecurity, energy efficiency and machine learning.