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Upcoming Events
FIRST by FMD – The European conference on microelectronic trends, roadmaps and strategic alignment
Join the leaders shaping Europe’s semiconductor future at FIRST by FMD, taking place 30 September – 1 October 2026 in Berlin.
INSIDE Connect 2026
Two days of strategic alignment, collaboration, and forward-thinking discussions shaping Europe’s digital future.
EFECS 2026
Join us from 𝟮 - 𝟯 𝗗𝗲𝗰𝗲𝗺𝗯𝗲𝗿, 𝟮𝟬𝟮𝟲, in 𝗛𝗲𝗹𝘀𝗶𝗻𝗸𝗶, 𝗙𝗶𝗻𝗹𝗮𝗻𝗱, for the next edition of the European Forum for Electronic Components and Systems, for a full week of networking opportunities and cultural activities!
Previous Events
Pre-Brokerage for Lab to Fab Accelerator projects on Advanced Packaging
The EPoSS Working Group Advanced Packaging invites to the Pre-Brokerage for Lab to Fab Accelerator projects on Advanced Packaging
Online Workshop on “Microelectronics for 6G – Front End Module”
The aim of this “Microelectronics for 6G – Front End Module” workshop is to gather detailed feedback about the needs, challenges and priorities of relevant stakeholders for a Focus Topic under consideration on the FEM extension
Chips JU Consultation Workshop Calls 2026: From Chips to Healthcare Services
Chips JU Consultation Workshop Calls 2026: From Chips to Healthcare Services The Chips Joint Undertaking is organising a series of workshops to explore topics for potential inclusion in the Work Programme 2026
INSIDE Connect 2025
INSIDE Connect 2025 The INSIDE Connect 2025 event — from 3 to 4 September — will give you a unique opportunity to re-engage, collaborate, and shape the future of our community.
ECS Summer School 2025
The ECS Summer School 2025 in Budapest, Hungary, offers a 5-day microelectronics program to inspire new talents for the European Electronics community.
